Product / Packages
Ambient Light Photo Sensors (ALPS) are used to measure the ambient light level in the environment as perceived by the human eye. It is designed to detect bright and dim ambient light conditions as a means of controlling the brightness of LCD display and/or keypad backlight
ATEC is a leading assembly service provider of Open-Cavity Sensor Packages for automotive and non-automotive applications. ATEC has been capable of assembling this type of package since 2000 and is now producing this for mass production. Open-Cavity Sensor Packages come in different varieties. With ATEC, these sensors are assembled to SOICs and QFNs with wide range of lead counts.
We offer other package types such as: Ceramic Packages, Hybrid, J Lead. LLCC, MCSP, MDIP, SMD Modules, Wafer Backgrind, and Wafer Saw.
SOT-23
Small Outline Transistor Plastic Package. SOT-23 package or its thin version (TSOT-23) is a leaded plastic surface mount transistor component. This device has three or more gull wing leads bent outwards at the tip. ATEC is currently tooled for 3, 5, and 6 terminals SOT-23. ATEC SOT-23 packages are JEDEC compliant.
3 Leads View Technical Details
6 Leads View Technical Details
5 Leads View Technical Details
SIP
Single In-line Package. SIP is a type of housing for electronic components in which the connecting pins protrude from one side, in contrast with DIP and PGA. A SIP is also called a Single In-line Pin Package (SIPP).
4 Leads
9 Leads
SOIC
Small Outline Integrated Circuit. A SOIC package is a leaded rectangular plastic surface mount integrated circuit with eight or more gull wing leads bent outwards at the tip. The leads are on two opposite sides of the package. ATEC is currently tooled for 8, 14, 16, 20, 24, and 28 terminals varying from narrow body (NB) and wide body (WB) SOIC. ATEC SOIC packages are JEDEC compliant.
8 Leads View Technical Details
16 Leads View Technical Details
24 Leads View Technical Details
28 Leads View Technical Details
32 Leads View Technical Details
SOIC e-Pad
Small Outline Integrated Circuit with Exposed Pad. SOIC e-Pad is a Small Outline Integrated Circuit with exposed pad at the bottom side of the package. Similar to standard SOIC package, it is a leaded rectangular plastic surface mount integrated circuit. ATEC is currently tooled for 8 terminals SOIC e-Pad. ATEC SOIC e-Pad package is JEDEC compliant.
CLCC/CQFN Package
10 Leads
20 Leads
32 Leads
CQFN
PDIP
4 Leads
8 Leads View Technical Details
16 Leads
COB
DFN/QFN
8 Leads DFN View Technical Details
10 Leads DFN View Technical Details
10 Leads DFN 3×3 View Technical Details
16 Leads DFN
16 Leads QFN View Technical Details
16 Leads QFN
48 Leads QFN View Technical Details
68 Leads QFN
72 Leads QFN
SMT
MCP
TO39
TO39 WITH METAL CAP